R
Ratz O. Fratzo
Properly lapped heatsinks with mirror finishes will only
require a translucent haze."
I think that is the key phrase there. Most heat sinks aren't machined
to that specification.
______________________
-=Ratz O. Fratzo =-
Properly lapped heatsinks with mirror finishes will only
require a translucent haze."
I mean the following passage at that link which implies
that a properly thin layer of thermal paste (perhaps thin
enough be a mere haze) wouldn't be able to ooze out:
"The flatter the mating surfaces, the thinner the layer that is
required. Stock processors and/or heatsinks with normal
surface irregularities will require a layer 0.003" to 0.005"
thick as shown below to fill the resultant gaps. (Equal to
the thickness of about 1 sheet of standard weight paper.)
Properly lapped heatsinks with mirror finishes will only
require a translucent haze."
W7TI said:I don't doubt that the above statement is true, but I believe it
to be irrelevant for nearly all of us. Who among us has ever
seen a "Properly lapped heatsinks with mirror finish"?
The purpose of the thermal compound is to compensate for
real-world gaps, peaks, concavities, convexities and other
irregularities.
If you think about what's happening when you press the
heatsink down in place, what difference does it make if a
little extra oozes out? On the other hand what difference
does it make if you don't have enough? Potentially a lot
of difference. I'm not talking about oozing major gobs
that drip all over. Just enough to see around the edges.
If you're sure you have no such irregularities waiting to bite
you, spread it as thin as you like.
Timothy Daniels said:without allowing air in. But, as I've said, that is just my intuitive
guess and not the result of experiment.
An experiment occurs to me: Get a glass bezel off a flashlight and
pretend to mount that on a CPU or simulator. See how easily air
pockets form and how translucent (==thin) the goop gets.
Timothy Daniels said:If you follow the Arctic Silver instructions (i.e. spreading on a film just
thick enough to discolor the surface), the small gap and the viscosity
of the paste would probably prevent any "oozing". This comment taken
from the instructions is indicative of the thickness of the layer of paste:
"The flatter the mating surfaces, the thinner the layer that is required.
Stock processors and/or heatsinks with normal surface irregularities
will require a layer 0.003" to 0.005" thick as shown below to fill the
resultant gaps. (Equal to the thickness of about 1 sheet of standard
weight paper.) Properly lapped heatsinks with mirror finishes will only
require a translucent haze."
w_tom said:Apply only enough thermal compound so that it spreads thin
in middle half of CPU. If too much compound is applied - if
it oozes out - then thermal compound also obstructs contact
between CPU and heat sink. Furthermore, thermal compound
oozing out and getting on CPU contact pins means potential
electrical problems. Never apply so much thermal compound as
to ooze out.
Put too much on and get less thermal
conductivity
w_tom said:Arctic Silver III is considered best thermal paste you can
buy because ... it is equivalent to most every other thermal
compound; but at something like 10 times the price. Arctic
Silver does noteven provide thermal conductivity numbers.
Why bother? They are not selling to people who first want
facts. They are selling to those more influenced by
propaganda and hype
HMSDOC said:I read the Arctic Silver directions and assume they would be
the same for the thermal compound that comes with the CPU
(no thermal tape in mine, just a syringe with compound). For
the *Intel P4* as opposed to CPUs with smaller heatsinks
(if that is the proper term for the metal plate) it clearly says not
to ooze at all. There is even a picture of removing the fan after
the fan/heatsink has been properly applied to show that the
entire plate on the CPU top should, in fact, not even be totally
covered...just the segment over the core. Believe it may be
different for non P4s but I didn't read that part carefully.
w_tom said:Apply no thermal compound - no problem. Put too little on,
still no problem but a small increase in thermal
conductivity. Put right amount on and get better thermal
conductivity. Put too much on and get less thermal
conductivity AND get problems with CPUs electrical pins.
If so much has been put on as to ooze out, then human does
not understand the concept. Too much thermal compound is the
worst of all applications.
HMSDOC said:Me again..I started the thread :>)
I read the Arctic Silver directions and assume they would be the same for the
thermal compound that comes with the CPU (no thermal tape in mine, just a
syringe with compound). For the *Intel P4* as opposed to CPUs with smaller
heatsinks (if that is the proper term for the metal plate) it clearly says not
to ooze at all. There is even a picture of removing the fan after the
fan/heatsink has been properly applied to show that the entire plate on the CPU
top should, in fact, not even be totally covered...just the segment over the
core.
JAD said:tom....
....over done.....well done... burnt....stick a fork in it...
as soon as the algebraic equations come out you know this post
is bordering the lunatic fringe
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