selecting proper and compatible RAM for two machines

G

g_1

The first machine configuration is below

-----------------------------------------------------------------------


Processors Information
Processor 1 ID = 0
Number of cores 2 (max 2)
Number of threads 2 (max 2)
Name Intel Core 2 Duo E6550
Codename Conroe
Specification Intel(R) Core(TM)2 Duo CPU E6550 @ 2.33GHz
Package (platform ID) Socket 775 LGA (0x0)
Core Stepping G0
Technology 65 nm
Core Speed 2000.1 MHz
Multiplier x FSB 6.0 x 333.4 MHz
Rated Bus speed 1333.4 MHz
Stock frequency 2333 MHz
Instructions sets MMX, SSE, SSE2, SSE3, SSSE3, EM64T
L1 Data cache 2 x 32 KBytes, 8-way set associative, 64-byte line
size
L1 Instruction cache 2 x 32 KBytes, 8-way set associative, 64-
byte line size
L2 cache 4096 KBytes, 16-way set associative, 64-byte line size
FID/VID Control yes
FID range 6.0x - 7.0x
Max VID 1.350 V






Chipset
Northbridge Intel X38 rev. 00
Southbridge Intel 82801IR (ICH9R) rev. 02
Graphic Interface PCI-Express
PCI-E Link Width x16
PCI-E Max Link Width x16
Memory Type DDR2
Memory Size 2048 MBytes
Channels Dual, (Symmetric)
Memory Frequency 333.4 MHz (1:1)
CAS# latency (CL) 5.0
RAS# to CAS# delay (tRCD) 5
RAS# Precharge (tRP) 5
Cycle Time (tRAS) 15
Row Refresh Cycle Time (tRFC) 36

Memory SPD
DIMM # 1
SMBus address 0x50
Memory type DDR2
Module format Regular UDIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 1024 MBytes
Max bandwidth PC2-5300 (333 MHz)
Part number M3 91T2953EZ3-CE6
Serial number 832C0807
Manufacturing date Week 02/Year 08
Number of banks 2
Data width 72 bits
Correction ECC
Nominal Voltage 1.80 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 3.0-3-3-9-12 @ 200 MHz
JEDEC #2 4.0-4-4-12-16 @ 266 MHz
JEDEC #3 5.0-5-5-15-20 @ 333 MHz

DIMM # 2
SMBus address 0x52
Memory type DDR2
Module format Regular UDIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 1024 MBytes
Max bandwidth PC2-5300 (333 MHz)
Part number M3 91T2953EZ3-CE6
Serial number 832C080B
Manufacturing date Week 02/Year 08
Number of banks 2
Data width 72 bits
Correction ECC
Nominal Voltage 1.80 Volts
EPP no
XMP no

JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 3.0-3-3-9-12 @ 200 MHz
JEDEC #2 4.0-4-4-12-16 @ 266 MHz
JEDEC #3 5.0-5-5-15-20 @ 333 MHz


Monitoring
Mainboard Model 0AA0h (0x0000014A - 0x00026480)



Hardware Monitors
Hardware monitor Intel Core 2 Duo E6550
Temperature 0 34°C (93°F) [0x42] (Core #0)
Temperature 1 35°C (94°F) [0x41] (Core #1)

Hardware monitor NVIDIA Quadro FX 370
Temperature 0 45°C (112°F) (GPU Core)


PCI Device
Description Host Bridge
Location bus 0 (0x00), device 0 (0x00), function 0 (0x00)
Common header
Vendor ID 0x8086
Model ID 0x29E0
Revision ID 0x00
PI 0x00
SubClass 0x00
BaseClass 0x06
Cache Line 0x00
Latency 0x00
Header 0x00
PCI header
Subvendor ID 0x103C
Subsystem ID 0x1308
Int. Line 0x00
Int. Pin 0x00
PCI capability
Caps class Vendor Dependant
Caps offset 0xE0

Description PCI to PCI Bridge
Location bus 0 (0x00), device 1 (0x01), function 0 (0x00)
Common header
Vendor ID 0x8086
Model ID 0x29E1
Revision ID 0x00
PI 0x00
SubClass 0x04
BaseClass 0x06
Cache Line 0x10
Latency 0x00
Header 0x01
PCI header
Primary bus 0x00
Secondary bus 0x01
Int. Line 0x10
Int. Pin 0x01
PCI capability
Caps class Subsystem Vendor
Caps offset 0x88
SubVendor ID 0x103C
SubSystem ID 0x1308
PCI capability
Caps class Power Management
Caps offset 0x80
Caps version 1.2
PCI capability
Caps class Message Signalled Interrupts
Caps offset 0x90
PCI capability
Caps class PCI Express
Caps offset 0xA0
Device type Root Port of PCI-E Root Complex
Port 2
Version 2.0
Physical slot #0
Presence detect yes
Link width 16x (max 16x)
Extended capabilities
Caps class Virtual Channel
Caps offset 0x100
Caps class Root Complex Link Declaration
Caps offset 0x140
Link Entries # 1
Port Number 2




DMI
DMI BIOS
vendor Hewlett-Packard
version 786F3 v01.06
date 01/29/2008

DMI System Information
manufacturer Hewlett-Packard
product HP xw4600 Workstation
version unknown
serial 2UA80809ZK
UUID 379D4229-92E1DC11-BBDA0BA4-EE2A001E

DMI Baseboard
vendor Hewlett-Packard
model 0AA0h
revision unknown
serial 2UA80809ZK

DMI System Enclosure
manufacturer Hewlett-Packard
chassis type Mini Tower
chassis serial 2UA80809ZK

DMI Processor
manufacturer Intel
model Intel(R) Core(TM)2 Duo CPU E6550 @ 2.33GHz
clock speed 2333.0 MHz
FSB speed 1333.0 MHz
multiplier 2.0x






DMI Physical Memory Array
location Motherboard
usage System Memory
correction Multi-bit ECC
max capacity 8192 MBytes
max# of devices 4

DMI Physical Memory Array
location Motherboard
usage Flash Memory
correction None
max capacity 4 MBytes
max# of devices 1

DMI Memory Device
designation XMM1
format DIMM
type unknown
total width 72 bits
data width 64 bits
size 1024 MBytes

DMI Memory Device
designation XMM2
format DIMM
type unknown

DMI Memory Device
designation XMM3
format DIMM
type unknown
total width 72 bits
data width 64 bits
size 1024 MBytes

DMI Memory Device
designation XMM4
format DIMM
type unknown

DMI Memory Device
designation SYSTEM ROM
format Chip
type FLASH
total width 2 bits
data width 2 bits
size 4 MBytes




Software
Windows Version Microsoft Windows Vista (6.0) Business Edition (Build
6000)
32 bit edition

The recommended RAM by crucial.com is
http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=351A7163A5CA7304
which is a

1GB, 240-pin DIMM, DDR2 PC2-5300 memory module
CT746875

* Module Size: 1GB
* Package: 240-pin DIMM
* Feature: DDR2 PC2-5300
* Specs: DDR2 PC2-5300 • CL=5 • Unbuffered • ECC • DDR2-667 • 1.8V
• 128Meg x 72 •

or http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=38D398F7A5CA7304
which is

1GB, 240-pin DIMM, DDR2 PC2-6400 memory module
CT759710

* Module Size: 1GB
* Package: 240-pin DIMM
* Feature: DDR2 PC2-6400
* Specs: DDR2 PC2-6400 • CL=6 • Unbuffered • ECC • DDR2-800 • 1.8V
• 128Meg x 72 •



The second machine configuration is below

-----------------------------------------------------------------------


Computer:
Operating System Microsoft Windows XP Professional
OS Service Pack Service Pack 2
DirectX 4.09.00.0904 (DirectX 9.0c)
Computer Name OAS1 (OfficeOfAssessment)
User Name Dexter

Motherboard:
CPU Type Intel Pentium 4 520, 2800 MHz (14 x 200)
Motherboard Name Dell OptiPlex GX280
Motherboard Chipset Intel Grantsdale-G i915G
System Memory 1014 MB (DDR2-400 DDR2 SDRAM)
BIOS Type Phoenix (09/17/04)
Communication Port Communications Port (COM1)
Communication Port ECP Printer Port (LPT1)


BIOS Properties:
Vendor Dell Inc.
Version A03
Release Date 09/17/2004
Size 512 KB
Boot Devices Floppy Disk, Hard Disk, CD-ROM, LS-120
Capabilities Flash BIOS, Shadow BIOS, Selectable Boot, EDD, BBS
Supported Standards DMI, APM, ACPI, PnP
Expansion Capabilities PCI, USB

[ System ]

System Properties:
Manufacturer Dell Inc.
Product OptiPlex GX280
Serial Number GKKCZ51
Universal Unique ID 44454C4C-4B00104B-8043C7C0-4F5A3531
Wake-Up Type Power Switch

[ Motherboard ]

Motherboard Properties:
Manufacturer Dell Inc.
Product 0G5611
Serial Number ..CN6986149E00DD.

[ Chassis ]

Chassis Properties:
Manufacturer Dell Inc.
Serial Number GKKCZ51
Chassis Type Mini Tower

[ Processors / Processor #1 ]

Processor Properties:
Manufacturer Intel
External Clock 800 MHz
Maximum Clock 3600 MHz
Current Clock 2800 MHz
Type Central Processor
Voltage 1.7 V
Status Enabled
Upgrade ZIF
Socket Designation Microprocessor



[ Memory Devices / DIMM_1 ]

Memory Device Properties:
Form Factor DIMM
Type SDRAM
Type Detail Synchronous
Size 512 MB
Speed 400 MHz
Total Width 64-bit
Data Width 64-bit
Device Locator DIMM_1

[ Memory Devices / DIMM_3 ]

Memory Device Properties:
Form Factor DIMM
Type SDRAM
Type Detail Synchronous
Size 512 MB
Speed 400 MHz
Total Width 64-bit
Data Width 64-bit
Device Locator DIMM_3

[ Memory Devices / DIMM_2 ]

Memory Device Properties:
Form Factor DIMM
Type SDRAM
Type Detail Synchronous
Speed 400 MHz
Total Width 64-bit
Data Width 64-bit
Device Locator DIMM_2

[ Memory Devices / DIMM_4 ]

Memory Device Properties:
Form Factor DIMM
Type SDRAM
Type Detail Synchronous
Speed 400 MHz
Total Width 64-bit
Data Width 64-bit
Device Locator DIMM_4

[ System Slots / PCI_E_1 ]

System Slot Properties:
Slot Designation PCI_E_1
Type PCI-E x1
Usage In Use
Length Long

[ System Slots / PCI_1 ]

System Slot Properties:
Slot Designation PCI_1
Type PCI
Usage In Use
Data Bus Width 32-bit
Length Long

[ System Slots / PCI_2 ]

System Slot Properties:
Slot Designation PCI_2
Type PCI
Usage Empty
Data Bus Width 32-bit
Length Long

[ System Slots / PCI_3 ]

System Slot Properties:
Slot Designation PCI_3
Type PCI
Usage In Use
Data Bus Width 32-bit
Length Long

[ System Slots / PEG ]

System Slot Properties:
Slot Designation PEG
Type PCI-E x1
Usage Empty
Length Long


Overclock

CPU Properties:
CPU Type Intel Pentium 4 520
CPU Alias Prescott
CPU Stepping D0
Engineering Sample No
CPUID CPU Name Intel(R) Pentium(R) 4 CPU 2.80GHz
CPUID Revision 00000F34h

CPU Speed:
CPU Clock 2794.76 MHz (original: 2800 MHz)
CPU Multiplier 14.0x
CPU FSB 199.63 MHz (original: 200 MHz)
Memory Bus 199.63 MHz

CPU Cache:
L1 Trace Cache 12K Instructions
L1 Data Cache 16 KB
L2 Cache 1 MB (On-Die, ECC, ATC, Full-Speed)

Motherboard Properties:
Motherboard ID <DMI>
Motherboard Name Dell OptiPlex GX280

Chipset Properties:
Motherboard Chipset Intel Grantsdale-G i915G
Memory Timings 3-3-3-8 (CL-RCD-RP-RAS)

SPD Memory Modules:
DIMM1: Samsung M3 78T6553BZ0-KCC 512 MB DDR2-400 DDR2 SDRAM
(5.0-3-3-8 @ 200 MHz) (4.0-3-3-8 @ 200 MHz) (3.0-3-3-8 @ 200 MHz)
DIMM3: Samsung M3 78T6553BZ0-KCC 512 MB DDR2-400 DDR2 SDRAM
(5.0-3-3-8 @ 200 MHz) (4.0-3-3-8 @ 200 MHz) (3.0-3-3-8 @ 200 MHz)

BIOS Properties:
System BIOS Date 09/17/04
Video BIOS Date 04/12/20
DMI BIOS Version A03

CPU

CPU Properties:
CPU Type Intel Pentium 4 520, 2800 MHz (14 x 200)
CPU Alias Prescott
CPU Stepping D0
Instruction Set x86, MMX, SSE, SSE2, SSE3
Original Clock 2800 MHz
Min / Max CPU Multiplier 14x / 14x
Engineering Sample No
L1 Trace Cache 12K Instructions
L1 Data Cache 16 KB
L2 Cache 1 MB (On-Die, ECC, ATC, Full-Speed)

Multi CPU:
Motherboard ID DELL Opti GX280
CPU #0 Intel(R) Pentium(R) 4 CPU 2.80GHz, 2793 MHz
CPU #1 Intel(R) Pentium(R) 4 CPU 2.80GHz, 2793 MHz

CPU Physical Info:
Package Type 775 Contact LGA
Package Size 3.75 cm x 3.75 cm
Transistors 125 million
Process Technology 7M, 90 nm, CMOS, Cu, Low-K Inter-Layer, High-K
Gate, Strained Si
Die Size 112 mm2
Core Voltage 1.425 V
I/O Voltage 1.425 V
Typical Power 84 - 115 W (depending on clock speed)
Maximum Power 101 - 151 W (depending on clock speed)

CPU Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/processor.htm

CPU Utilization:
CPU #1 / HTT Unit #1 0 %
CPU #1 / HTT Unit #2 43 %


CPUID

CPUID Properties:
CPUID Manufacturer GenuineIntel
CPUID CPU Name Intel(R) Pentium(R) 4 CPU 2.80GHz

IA CPU Serial Number Unknown
Microcode Update Revision 13
HTT / CMP Units 2 / 1

Instruction Set:
64-bit x86 Extension (AMD64, EM64T) Not Supported
Alternate Instruction Set Not Supported
AMD 3DNow! Not Supported


Motherboard

Motherboard Properties:
Motherboard ID <DMI>
Motherboard Name Dell OptiPlex GX280

Front Side Bus Properties:
Bus Type Intel NetBurst
Bus Width 64-bit
Real Clock 200 MHz (QDR)
Effective Clock 800 MHz
Bandwidth 6400 MB/s

Memory Bus Properties:
Bus Type Dual DDR2 SDRAM
Bus Width 128-bit
Real Clock 200 MHz (DDR)
Effective Clock 400 MHz
Bandwidth 6400 MB/s

Chipset Bus Properties:
Bus Type Intel Direct Media Interface

Motherboard Manufacturer:
Company Name Dell Computer Corporation
Product Information http://www.dell.com
BIOS Download http://support.dell.com


Memory

Physical Memory:
Total 1014 MB
Used 574 MB
Free 439 MB
Utilization 57 %

Swap Space:
Total 2444 MB
Used 444 MB
Free 1999 MB
Utilization 18 %

Virtual Memory:
Total 3458 MB
Used 1019 MB
Free 2438 MB
Utilization 29 %

Physical Address Extension (PAE):
Supported by Operating System Yes
Supported by CPU Yes
Active No


SPD

[ DIMM1: Samsung M3 78T6553BZ0-KCC ]

Memory Module Properties:
Module Name Samsung M3 78T6553BZ0-KCC
Serial Number 02019477h
Module Size 512 MB (1 rank, 4 banks)
Module Type Unbuffered
Memory Type DDR2 SDRAM
Memory Speed DDR2-400 (200 MHz)
Module Width 64 bit
Module Voltage SSTL 1.8
Error Detection Method None
Refresh Rate Reduced (7.8 us)

Memory Timings:
@ 200 MHz 5.0-3-3-8 (CL-RCD-RP-RAS)
@ 200 MHz 4.0-3-3-8 (CL-RCD-RP-RAS)
@ 200 MHz 3.0-3-3-8 (CL-RCD-RP-RAS)

Memory Module Features:
Early RAS# Precharge Supported
Auto-Precharge Not Supported
Precharge All Not Supported
Write1/Read Burst Not Supported
Buffered Address/Control Inputs Not Supported
Registered Address/Control Inputs Not Supported
On-Card PLL (Clock) Not Supported
Buffered DQMB Inputs Not Supported
Registered DQMB Inputs Not Supported
Differential Clock Input Not Supported
Redundant Row Address Not Supported

Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm

[ DIMM3: Samsung M3 78T6553BZ0-KCC ]

Memory Module Properties:
Module Name Samsung M3 78T6553BZ0-KCC
Serial Number 020F9482h
Module Size 512 MB (1 rank, 4 banks)
Module Type Unbuffered
Memory Type DDR2 SDRAM
Memory Speed DDR2-400 (200 MHz)
Module Width 64 bit
Module Voltage SSTL 1.8
Error Detection Method None
Refresh Rate Reduced (7.8 us)

Memory Timings:
@ 200 MHz 5.0-3-3-8 (CL-RCD-RP-RAS)
@ 200 MHz 4.0-3-3-8 (CL-RCD-RP-RAS)
@ 200 MHz 3.0-3-3-8 (CL-RCD-RP-RAS)

Memory Module Features:
Early RAS# Precharge Supported
Auto-Precharge Not Supported
Precharge All Not Supported
Write1/Read Burst Not Supported
Buffered Address/Control Inputs Not Supported
Registered Address/Control Inputs Not Supported
On-Card PLL (Clock) Not Supported
Buffered DQMB Inputs Not Supported
Registered DQMB Inputs Not Supported
Differential Clock Input Not Supported
Redundant Row Address Not Supported

Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm


Chipset

[ North Bridge: Intel Grantsdale-G i915G ]

North Bridge Properties:
North Bridge Intel Grantsdale-G i915G
Revision / Stepping 04 / B1
Package Type 1210 Pin FC-BGA
Package Size 3.75 cm x 3.75 cm
Core Voltage 1.5 V
In-Order Queue Depth 12

Memory Controller:
Type Dual Channel (128-bit)
Active Mode Dual Channel (128-bit)

Memory Timings:
CAS Latency (CL) 3T
RAS To CAS Delay (tRCD) 3T
RAS Precharge (tRP) 3T
RAS Active Time (tRAS) 8T

Error Correction:
ECC Not Supported
ChipKill ECC Not Supported
RAID Not Supported
ECC Scrubbing Not Supported

Memory Slots:
DRAM Slot #1 512 MB (DDR2-400 DDR2 SDRAM)
DRAM Slot #2 512 MB (DDR2-400 DDR2 SDRAM)



Chipset Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/chipsets.htm
Driver Download http://support.intel.com/support/chipsets/index.htm

[ South Bridge: Intel 82801FB ICH6 ]

South Bridge Properties:
South Bridge Intel 82801FB ICH6
Revision / Stepping D3 / B1
Package Type 609 Pin mBGA
Package Size 3.1 cm x 3.1 cm
Core Voltage 1.5 V

PCI Express Controller:
PCI-E x1 port #1 In Use @ x1 (Broadcom NetXtreme BCM5750 Gigabit
Ethernet Controller)
PCI-E x1 port #2 Empty

Chipset Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/chipsets.htm
Driver Download http://support.intel.com/support/chipsets/index.htm


BIOS

BIOS Properties:
BIOS Type Phoenix
System BIOS Date 09/17/04
Video BIOS Date 04/12/20

BIOS Manufacturer:
Company Name Phoenix Technologies Ltd.
Product Information http://www.phoenix.com/en/products/default.htm
BIOS Upgrades http://www.esupport.com/biosagent/index.cfm?refererid=40

Problems & Suggestions:
Suggestion Are you looking for a BIOS Upgrade? Contact eSupport
Today!
Suggestion System BIOS is more than 2 years old. Update it if
necessary.


Windows Video





Desktop



[ System devices / Motherboard resources ]

Device Properties:
Driver Description Motherboard resources
Driver Date 7/1/2001
Driver Version 5.1.2600.0
Driver Provider Microsoft
INF File machine.inf
Hardware ID ACPI\PNP0C02
PnP Device Motherboard Resources


Physical Devices



[ Intel 82915G Memory Controller Hub [B-1] ]

Device Properties:
Device Description Intel 82915G Memory Controller Hub [B-1]
Bus Type PCI
Bus / Device / Function 0 / 0 / 0

Device Class 0600 (Host/PCI Bridge)
Revision 04
Fast Back-to-Back Transactions Supported, Disabled

Device Features:
66 MHz Operation Not Supported
Bus Mastering Enabled

The recommended RAM by crucial.com is
http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=0504A1F4A5CA7304
which is
1GB, Ballistix 240-pin DIMM, DDR2 PC2-6400 memory module
CT832480

* Module Size: 1GB
* Package: Ballistix 240-pin DIMM
* Feature: DDR2 PC2-6400
* Specs: DDR2 PC2-6400 • 4-4-4-12 • Unbuffered • NON-ECC •
DDR2-800 • 2.0V • 128Meg x 64 •

or http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=562217F8A5CA7304
which is
1GB, 240-pin DIMM, DDR2 PC2-5300 memory module
CT657133

* Module Size: 1GB
* Package: 240-pin DIMM
* Feature: DDR2 PC2-5300
* Specs: DDR2 PC2-5300 • CL=5 • Unbuffered • NON-ECC • DDR2-667 •
1.8V • 128Meg x 64

Can someone please clarify which would be a better choice for both of
my
machine configurations?

Are there any other things I need to be aware of?

Thanks a lot.
 
P

Paul

g_1 said:
Can someone please clarify which would be a better choice for both of
my machine configurations?

Are there any other things I need to be aware of?

Thanks a lot.

HP xw4600 Workstation
Northbridge Intel X38 (ECC capable)
DIMM # 1
Size 1024 MBytes
Max bandwidth PC2-5300 (DDR2-667)
Data width 72 bits
Correction ECC
CAS# latency (CL) 5.0
Dimm # 2
(Same)

Software Windows Vista (6.0) Business Edition 32 bit edition

Motherboard has four slots. Current configuration is 2GB and uses two slots.

You don't say what memory target you're aiming for, so I have to guess.

User seeks incremental upgrade to 4GB total, of which the
32 bit OS limits the actual free memory reported (may report 3.25GB
or less). X38 can take 8GB of memory (4x2GB), but the 32 bit OS
currently in use, prevents such a capability from being used.

http://www.crucial.com/store/listparts.aspx?model=xw4600

For $63, this will max the usable memory possible with
the current OS choice. 2x1GB PC2-5300 CAS5 ECC unbuffered kit.
Free memory reported could be around 3.25GB or so. (How much
less than 4GB gets reported, depends on the address space
needed by the video card. The video card details aren't
stated in the original text dump.)

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=FE2BF561A5CA7304

For $37, this is the cheapest upgrade, to almost as much
memory as you can use in your current circumstances. But
I consider the purchase of these modules, to have little to
no future resale value. Free memory reported should be
3.0GB or so. 2x512MBB PC2-5300 CAS5 ECC unbuffered kit.

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=F2BEEF63A5CA7304

The PC2-6400 CAS6 product you're looking at, would run PC2-5300 CAS5
if added to the existing 2x1GB modules. So there isn't much
difference between the purchases. If you were starting
from scratch, with no memory in the computer, then there
may be more room for discussion of what to do.

*******

Dell OptiPlex GX280
Northbridge Intel Grantsdale-G i915G
DIMM # 1
Module Size 512 MB
Memory Speed DDR2-400 3.0-3-3-8 (i.e. CAS3 as lowest CAS)
Data Width 64-bit (i.e. non-ECC)
DIMM # 2
(Same)

The desktop and mini-tower form factors, have four RAM slots.

http://www.crucial.com/store/listparts.aspx?model=OptiPlex GX280 (Desktop and Mini-tower Models)

The Intel memory guide for 915. You have to stare at the figures
for a few minutes, to see just how clever they're being
with the examples. Chipset has Flex Memory, so 2x256MB can be
placed in one channel, and a 512MB stick balances it in the
other channel. (I wish they'd cleaned up this doc before release.)

http://download.intel.com/design/chipsets/applnots/30167003.pdf

Again, I don't know what the upgrade target is for total memory.
For example, you could toss the existing 2x512MB and put some
other memory in there. Or, you could keep the existing memory.

It looks like the maximum module size is 1GB per slot, according
to Crucial. If I look at the Intel datasheet for 915G (30146705.pdf),
the chipset can handle 2GB density modules, so at least there
won't be any issues with module density/type at the 1GB level.

You were looking at some fancy memory. PC2-6400 CAS4 Voltage 2.0 volts.
That is fine, except that pre-built computers are more likely to
operate the voltage at the stock 1.8 volts. Since the computer
probably won't run the modules at PC2-6400, but operates at
a max of PC2-4300 (DDR2-533), that might not be much of an issue.
The fancy modules also have heat spreaders, and if the four
slots are close to one another, that can actually work
against proper cooling. Modules without heat spreaders,
leave a fraction of an inch for air flow, which is better
than nothing.

So what would I buy ? If it was my computer, I would
toss the 2x512MB DDR2-400 and replace with 2x1GB. The
reason being, that perhaps the memory will end up running
at a slightly faster speed.

I'd pick the less cosmetically appealing kit, advertised
to work at 1.8V. 2x1GB PC2-5300 CAS5. On the assumption
these don't have heat spreaders on the outside. These
might run CAS4 at PC2-4300 (DDR2-533).

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=13C795F8A5CA7304

Faster memory can run at slower speeds, so there is no
problem plugging in a 2x1GB kit of these. PC2-6400 CAS4.
I don't expect the voltage will be an issue. (Lower speed settings
may get away with less voltage.) The previous module kit choice
is if you cannot afford any surprises at all. The following kit
is fine, with its heat spreaders, if all four modules won't
be present. But if there are four modules to be used, and
the slots are close together, the middle two modules might
have a higher operating temperature as a result. The outside
modules, would have at least one metal surface exposed to
cooling air. Running the PC2-6400 module at PC2-4300, would
allow the CAS to go virtually as low as the chipset would
support (which could be CAS3). So this kit would give your
CAS a one notch lower setting, as long as the BIOS agrees
with the notion. If your machine has wide DIMM slot spacing,
or excellent memory cooling, then you can ignore the heat
spreader issue.

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=FFE0BD8CA5CA7304

By installing in pairs, you get dual channel operation. But
the Intel memory guide also shows, you could place three
modules in the computer. Put 2x512MB on one channel, 1x1GB on
the other channel, and Flex Memory runs that as dual channel.
So there are other options here. You don't have to use a dual
channel kit, if you're saving money or whatever.

If you mixed the 2x512 DDR2-400 (PC2-3200) with one stick
of 1GB PC2-6400, the whole thing will run at DDR2-400 CAS3.
That would give you 2GB of memory, running at the original
speed and CAS. So you can mix radically different memories
together if you want.

Paul
 
G

g_1

Paul said:
HP xw4600 Workstation
Northbridge Intel X38 (ECC capable)
DIMM # 1
Size 1024 MBytes
Max bandwidth PC2-5300 (DDR2-667)
Data width 72 bits
Correction ECC
CAS# latency (CL) 5.0
Dimm # 2
(Same)

Software Windows Vista (6.0) Business Edition 32 bit edition

Motherboard has four slots. Current configuration is 2GB and uses two slots.

You don't say what memory target you're aiming for, so I have to guess.

User seeks incremental upgrade to 4GB total, of which the
32 bit OS limits the actual free memory reported (may report 3.25GB
or less). X38 can take 8GB of memory (4x2GB), but the 32 bit OS
currently in use, prevents such a capability from being used.

http://www.crucial.com/store/listparts.aspx?model=xw4600

For $63, this will max the usable memory possible with
the current OS choice. 2x1GB PC2-5300 CAS5 ECC unbuffered kit.
Free memory reported could be around 3.25GB or so. (How much
less than 4GB gets reported, depends on the address space
needed by the video card. The video card details aren't
stated in the original text dump.)

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=FE2BF561A5CA7304

For $37, this is the cheapest upgrade, to almost as much
memory as you can use in your current circumstances. But
I consider the purchase of these modules, to have little to
no future resale value. Free memory reported should be
3.0GB or so. 2x512MBB PC2-5300 CAS5 ECC unbuffered kit.

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=F2BEEF63A5CA7304

The PC2-6400 CAS6 product you're looking at, would run PC2-5300 CAS5
if added to the existing 2x1GB modules. So there isn't much
difference between the purchases. If you were starting
from scratch, with no memory in the computer, then there
may be more room for discussion of what to do.

*******

Dell OptiPlex GX280
Northbridge Intel Grantsdale-G i915G
DIMM # 1
Module Size 512 MB
Memory Speed DDR2-400 3.0-3-3-8 (i.e. CAS3 as lowest CAS)
Data Width 64-bit (i.e. non-ECC)
DIMM # 2
(Same)

The desktop and mini-tower form factors, have four RAM slots.

http://www.crucial.com/store/listparts.aspx?model=OptiPlex GX280 (Desktop and Mini-tower Models)

The Intel memory guide for 915. You have to stare at the figures
for a few minutes, to see just how clever they're being
with the examples. Chipset has Flex Memory, so 2x256MB can be
placed in one channel, and a 512MB stick balances it in the
other channel. (I wish they'd cleaned up this doc before release.)

http://download.intel.com/design/chipsets/applnots/30167003.pdf

Again, I don't know what the upgrade target is for total memory.
For example, you could toss the existing 2x512MB and put some
other memory in there. Or, you could keep the existing memory.

It looks like the maximum module size is 1GB per slot, according
to Crucial. If I look at the Intel datasheet for 915G (30146705.pdf),
the chipset can handle 2GB density modules, so at least there
won't be any issues with module density/type at the 1GB level.

You were looking at some fancy memory. PC2-6400 CAS4 Voltage 2.0 volts.
That is fine, except that pre-built computers are more likely to
operate the voltage at the stock 1.8 volts. Since the computer
probably won't run the modules at PC2-6400, but operates at
a max of PC2-4300 (DDR2-533), that might not be much of an issue.
The fancy modules also have heat spreaders, and if the four
slots are close to one another, that can actually work
against proper cooling. Modules without heat spreaders,
leave a fraction of an inch for air flow, which is better
than nothing.

So what would I buy ? If it was my computer, I would
toss the 2x512MB DDR2-400 and replace with 2x1GB. The
reason being, that perhaps the memory will end up running
at a slightly faster speed.

I'd pick the less cosmetically appealing kit, advertised
to work at 1.8V. 2x1GB PC2-5300 CAS5. On the assumption
these don't have heat spreaders on the outside. These
might run CAS4 at PC2-4300 (DDR2-533).

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=13C795F8A5CA7304

Faster memory can run at slower speeds, so there is no
problem plugging in a 2x1GB kit of these. PC2-6400 CAS4.
I don't expect the voltage will be an issue. (Lower speed settings
may get away with less voltage.) The previous module kit choice
is if you cannot afford any surprises at all. The following kit
is fine, with its heat spreaders, if all four modules won't
be present. But if there are four modules to be used, and
the slots are close together, the middle two modules might
have a higher operating temperature as a result. The outside
modules, would have at least one metal surface exposed to
cooling air. Running the PC2-6400 module at PC2-4300, would
allow the CAS to go virtually as low as the chipset would
support (which could be CAS3). So this kit would give your
CAS a one notch lower setting, as long as the BIOS agrees
with the notion. If your machine has wide DIMM slot spacing,
or excellent memory cooling, then you can ignore the heat
spreader issue.

http://www.crucial.com/store/mpartspecs.aspx?mtbpoid=FFE0BD8CA5CA7304

By installing in pairs, you get dual channel operation. But
the Intel memory guide also shows, you could place three
modules in the computer. Put 2x512MB on one channel, 1x1GB on
the other channel, and Flex Memory runs that as dual channel.
So there are other options here. You don't have to use a dual
channel kit, if you're saving money or whatever.

If you mixed the 2x512 DDR2-400 (PC2-3200) with one stick
of 1GB PC2-6400, the whole thing will run at DDR2-400 CAS3.
That would give you 2GB of memory, running at the original
speed and CAS. So you can mix radically different memories
together if you want.

Paul

THANK YOU very much for the detailed response.

I APPRECIATE your help and time.

Thanks again.
 

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