Artic Silver 5 + 3.0Ghz P4

[John Smith]

Hi,

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

I had installed the heatsink, a Zalman Flower - the fan is on full - onto
the CPU using the new Artic Silver 5 which has instructions to basically put
a rice grain size of AS4 in the centre of the CPU, place the heatsink on
top, gently wiggle it around a bit and then let it run in for 200 hours.

Are these temps too high? Being used to covering the CPU in thermal paste I
am a touch concerned that I may not have enough between the CPU and the HS
although, as I said, I have followed Artic Silver's instructions precisely.

I don't normally take notice of CPU temps as I do not overclock but am a
touch concerned about whether enough AS5 is, well, enough if you see what I
mean.

Thanks for any info,


John.

 

[KB]

" have followed Artic Silver's instructions precisely"
And what exactly did it say to do?

 

[John Smith]

Forgot to say, the 3.0Ghz CPU is an 800FSB.

John.

 

[Rob Morley]

Hi,

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

So exercise it and see how hot it gets?

 

[Barry Watzman]

There is nothing wrong with those temps (37/98).

 

[Paul Hopwood]

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

Maybe a couple of degrees warmer than I'd expect but still within safe
limits and it may well drop as the cooler "beds in".

I'm running a P4 2.8Ghz with stock Intel cooler + Arctic Silver 3 and
getting core temps of around 30C when idle, so I certainly wouldn't be
overly concerned with yours.


--

 

[Leythos]

Hi,

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

I had installed the heatsink, a Zalman Flower - the fan is on full - onto
the CPU using the new Artic Silver 5 which has instructions to basically put
a rice grain size of AS4 in the centre of the CPU, place the heatsink on
top, gently wiggle it around a bit and then let it run in for 200 hours.

Are these temps too high? Being used to covering the CPU in thermal paste I
am a touch concerned that I may not have enough between the CPU and the HS
although, as I said, I have followed Artic Silver's instructions precisely.

I don't normally take notice of CPU temps as I do not overclock but am a
touch concerned about whether enough AS5 is, well, enough if you see what I
mean.

Most thermal paste gets gooped on way to thick and actually acts as a
poor heat conductor. The optimal amount is one that fills the gaps
between the surface differences and nothing more. If the surfaces are
not smooth then they won't conduct heat properly - even a smooth surface
is not really smooth, the paste makes up for the roughness and provides
even more touching surface area to pass heat.

 

[William W. Plummer]

Are these temps too high? Being used to covering the CPU in thermal paste I
am a touch concerned that I may not have enough between the CPU and the HS
although, as I said, I have followed Artic Silver's instructions

precisely.
If it works, it works. Just use it.

I don't normally take notice of CPU temps as I do not overclock but am a
touch concerned about whether enough AS5 is, well, enough if you see what I
mean.

Or, you could buy a faster CPU and not overclock it. You seem to be looking
for a problem to solve.

 

[Tim]

John,

"Wiggling" is not a good idea - it tears the smooth surface of the thermal
grease and can result in hot spots.
I did this once and had a cpu that ran cool until I printed to a color
printer and it would shoot up to 65c in a flash.

I think if you revisit the arctic silver we site you will see it says to be
careful not to do this. IE put hte gunk on, smooth it, put the heatsink on
downards and don't wiggle.

37c doesn't mean anything if we don't know the ambient temp. If ambient were
< 20c then this is high, if 25c then this is OK.

- Tim

 

[John Smith]

By 'wiggle' I meant the clockwise/anti-clockwise motion per the
instructions.

 

[Paul Hopwood]

"Wiggling" is not a good idea - it tears the smooth surface of the thermal
grease and can result in hot spots.
I did this once and had a cpu that ran cool until I printed to a color
printer and it would shoot up to 65c in a flash.

I think if you revisit the arctic silver we site you will see it says to be
careful not to do this. IE put hte gunk on, smooth it, put the heatsink on
downards and don't wiggle.

Arctic Silver definitely say wiggle:-

http://www.arcticsilver.com/arctic_silver_instructions.htm

"Once the heatsink is properly mounted, grasp the heatsink and very
gently wiggle it slightly clockwise and counterclockwise one time each
if possible. (Just one or two degrees or so.)"


--

 

[Tim]

1 or 2 degress - thats a micro wiggle in my books

The thing to avoid is macro wiggle.

- Tim

 

[billy_bat]

1 or 2 degress - thats a micro wiggle in my books

The thing to avoid is macro wiggle.

- Tim

ahh, a new term for the FAQ!
BB

 

[Jan]

Hi,

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

I have been checking the temperatures shown in the BIOS of my nearly-new P4
3GHz, 800MHz FSB, on an Intel 875P motherboard, with the standard Intel HSF.

With the computer under only a light load, the air temperature in the centre
of the case is 32 C, and the BIOS reports the Processor Zone Temp to be 48
C.

I thought this reasonable as I understand Intel to say the maximum working
temperature at the core of the CPU for a P4 is 68 - 70 C.

This is my first experience with a P4, and the temperatures I am getting
seem higher than those reported elsewhere in this thread. Should I be
concerned because they are higher?

 

[John Smith]

Thanks, I knew I read it.... four or five times before I did the install

 

[Philip Callan]

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Hash: SHA1

Jan wrote:

| |
|>Hi,
|>
|>I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2
|
| x
|
|>512 3200 Memory. I have had the PC running for about 48 hours and the PC
|
| is
|
|>not doing that much. The temps for the CPU are currently 37 C / 98 F.
|>
|
| I have been checking the temperatures shown in the BIOS of my
nearly-new P4
| 3GHz, 800MHz FSB, on an Intel 875P motherboard, with the standard
Intel HSF.
|
| With the computer under only a light load, the air temperature in the
centre
| of the case is 32 C, and the BIOS reports the Processor Zone Temp to be 48
| C.
|

Sounds like you could use another Intake fan (80 or 120mm) as your
ambient case temperature is one of the reasons the processor is slightly
warm. Of course, you could be stationed at the Death Valley research
outpost, so those ambients may be great.



Also, you may want to verify that the HSF is properly mounted. Sometimes
if its off center a tad, it will still cool, but not like it should.

| I thought this reasonable as I understand Intel to say the maximum working
| temperature at the core of the CPU for a P4 is 68 - 70 C.

Under maximum load, yeah. And dont worry, the P4 will begin to throttle
its speed back once you get near that point, eventually shutting down
(hopefully) before any damage is done (unlike old AMD (new are supposed
to be getting better))

| This is my first experience with a P4, and the temperatures I am getting
| seem higher than those reported elsewhere in this thread. Should I be
| concerned because they are higher?

They are a bit high, but not excessively, Like I said, check your
airflow/fans and then check your HSF, whatever it is, should be solvable
pretty easy.
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[w_tom]

Appreciate why you must 'wiggle'. Best heat transfer
(lowest thermal resistance) is from CPU direct to heatsink -
no thermal compound in that path. Every media change means
increased thermal resistance - less heat transfer. Reduce
thermal resistance - meaning the best interface is 'CPU direct
to heatsink'. Most of heat is transferred through this 'CPU
to heatsink' interface.

But that interface may also have some microscopic air
spaces. Now we have some 'CPU to air to heatsink' in scattered
locations. To improve that thermal resistance, we convert the
connection into 'CPU to thermal compound to heatsink'.

Too much thermal compound means too many 'CPU to thermal
compound to heatsink' interfaces. Therefore the amount of
thermal compound should be so minimal that no thermal compound
is 'squeezed' into the outer half of CPU. Most all heat
transfers in the center section; almost none in the outer
half. If too much thermal compound was used, then too many
'CPU to heatsink' interfaces are now separated by thermal
compound - not good. Thermal compound should be applied so
minimally that it only takes up those microscopic air gaps.
And then that layer minimized even more by 'wiggling'.

Better heatsinks are not perfectly flat. Better heatsinks
maximize pressure between heatsink and CPU at the center -
where almost all heat gets transferred. This again to make as
much direct 'CPU to heatsink' direct connection as is
possible.

If the heatsink is properly machined, then the thermal
compound will result in less than 10 degree C temperature
improvement. That is what filling those microscopic holes do
- a minor improvement (decrease) in thermal resistance.

 

[w_tom]

Assuming ambient temperature is 20 degree C, then a case
temperature of 32 degree is quiet acceptable. Add a second
chassis fan (both removing air from same location in same
direction) and that case temperature may drop to 26. Not a
significant drop - provides you no advantage.

System should still work just fine when room temperature
goes to 100 F - another 18 degree C higher; a normal room
temperature for any properly designed machine.

 

[Conor]

Hi,

I just installed a 3.0Ghz P4 into a Asus P4P800 Deluxe 865 mobo running 2 x
512 3200 Memory. I have had the PC running for about 48 hours and the PC is
not doing that much. The temps for the CPU are currently 37 C / 98 F.

I had installed the heatsink, a Zalman Flower - the fan is on full - onto
the CPU using the new Artic Silver 5 which has instructions to basically put
a rice grain size of AS4 in the centre of the CPU, place the heatsink on
top, gently wiggle it around a bit and then let it run in for 200 hours.

Are these temps too high? Being used to covering the CPU in thermal paste I
am a touch concerned that I may not have enough between the CPU and the HS
although, as I said, I have followed Artic Silver's instructions precisely.

I don't normally take notice of CPU temps as I do not overclock but am a
touch concerned about whether enough AS5 is, well, enough if you see what I
mean.

Artic Silver is bullshit. People buy it somehow thinking that a dollop
of heatsink paste will somehow magically lower their temps by 10
degrees. WEll it won't. THe difference between a good and bad heatsink
compound is a few degrees at most. Hardly enough to compensate or
contribute to bad cooling.

I just use bog standard transistor heatsink paste. I've had the same
tube for over 5 years and I'm running a XP3200 with a Coolermaster
Aero7 on the lowest fan speed setting at 32C.


--
Conor

"The vast majority of Iraqis want to live in a peaceful, free world.
And we will find these people and we will bring them to justice."
- George Bush

 

[Jan]

Some words from an Intel web page are relevant to the discussion about the
way thermal paste is to be applied.

http://support.intel.com/support/processors/pentium4/sb/CS-007989.htm



The boxed Intel Pentium 4 processor will have thermal interface material
attached to the bottom of the heatsink … or included in an applicator. If
included in an applicator, apply all of the thermal interface material to
the center of the processor's integrated heat spreader.



Allow the heatsink base to compress (without rotating or twisting) the
thermal interface material over the surface of the processor's integrated
heat spreader.



It is important to not allow the heatsink to rotate or twist on the
processor's integrated heat spreader.