windwithme's LGA 1156 review part5-DFI LANParty DK X58-T3eH9 Overclocking test


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windwithme's LGA 1156 review part5-DFI LANParty DK P55-T3eH9 Overclocking test

LGA 1156 is the latest Intel platform which announced two months ago.
P55 is the first chipset designed for the new platform; and at this moment, there are three LGA 1156 CPUs in retail,
Core i5-750, i7-860 & i7-870. By following Intel’s marketing segmentation, almost every MB manufacturers launched P55 product for mainstream to mid-high market.

DFI LANParty launched P55 later than other brands; finally, we found DFI P55 in market in the end of October.
Recently, we also heard some news about DFI’s P55 in mini-ITX form factor, maybe DFI want to create a different segment for P55?

DFI LANParty launched P55 later than other brands; finally, we found DFI P55 in market in the end of October.
Recently, we also heard some news about DFI’s P55 in mini-ITX form factor, maybe DFI want to create a different segment for P55?

The product I review today is DK version, the mid-range product in LANParty series.
The full marketing name is “DFI LANParty DK P55-T3eH9”. (DK P55 for short).

You can find blue & black color on package; DFI adopts this pattern since early 2009.
ddkp5501.jpg


Accessories
User manual, ABS manual (auto overclocking), DVD driver disc, I/O shield, Crossfire & SLI bridge, USB cable (for BIOSecure function).
ddkp5502.jpg


DFI LANParty DK-P55 T3eH9
ddkp5503.jpg


ddkp5504.jpg


Bottom left of DK P55
3 PCIe, supports 2-way CrossfireX & SLI with Physics (Bandwidth: x16/ x4/ x0 or x8/ x4/x8)
2 PCIe x1
2 PCI
Intel 82587DV GbE LAN, Debug LED
Realtek ALC 885 for 7.1 channels HD audio
ddkp5505.jpg


Bottom right of DK P55
6 SATA II connectors in orange (RAID 0/1/0+1/5 function from P55 chipset)
2 SATA II connectors in black (RAID 0/1 function from JMB322)
Power/ Reset buttons
ddkp5506.jpg


Upper right
4 DDR3 DIMM in Dual channel architecture; ready for DDR3 1066/ 1333/ 1600/ 1800(OC); max capacity is 16GB (4G x 4)
You should OC DDR3 to reach 1800MHz. You can also find 24-pin DC in connector here.
ddkp5507.jpg


Upper left
LGA 1156 socket
PWM: 6 phase for CPU, 2 phase for VTT, 1 phase for the incoming Clarkdale.
ddkp5508.jpg


I/O
4 USB 2.0
1 power eSATA/ 1 USB 2.0
1 optical/ Coaxial S/PDIF
1 RJ-45 LAN port
1 Clear CMOS button
1 mini USB port for BIOSecure
ddkp5509.jpg


Cooler module for DK P55
ddkp5510.jpg
 
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There is an extra fin module in middle for enlarging the surface for better heat dissipation.
ddkp5511.jpg


Cooler module for MOSFET; DFI indeed improves the cooler quality for DK series.
ddkp5512.jpg


Tantalum Capacitor for audio
“Solid capacitor” produces “artificial” sound, so DFI adopts Tantalum cap in audio circuit.
ddkp5513.jpg


The memory bandwidth of P55 is less than X58 because the dual channel architecture.
ddkp5514.jpg



Boot up screen
ddkp55b01.jpg


BIOS menu
It’s the first time DFI adopts AMI BIOS. You can choose the language you want when log in BIOS menu.
ddkp55b02.jpg


OC main menu
ddkp55b03.jpg


Options for CPU
ddkp55b04.jpg


Voltage setting page
O.C. Shut Down Free: DFI patent technology; no “turn off the power” needed when changing the voltage.
CPU Voltage 1.0000~2.0000V
Power Saving Standard means turn ”Vdroop” off; Advance means you allow voltage droop
Super VID ON means lock down the voltage when enabling EIST/C1E.
CPU VTT Voltage +0.05~+0.697V
DRAM Voltage 1.20~2.60V
ddkp55b05.jpg


CPU/DRAMCOMP: When enabling this option, you can get 1~5MHz higher in bclk.
ddkp55b06.jpg
 
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DDR3 setting in detail
ddkp55b07.jpg


CMOS RELOADED: there are four banks for saving customized profile.
ddkp55b08.jpg


PC status
ddkp55b09.jpg


This is my BIOS setting screen capture.
The potential of OC is depending on CPU quality.
Even you get two or more i5-750 which was produced in the same time, the OC result will be totally different.
So, you have to adjust frequency & voltage carefully to get the best result.


Configuration
CPU: Intel Core i5-750
MB: DFI LANParty DK-P55 T3eH9
DRAM: CORSAIR DOMINATOR-GT CMG4GX3M2A2000C8
VGA: GIGABYTE GTX260 OC
HD: CORSAIR CMFSSD-64GB2D (RAID 0)
POWER: be quiet! STRAIGHT POWER DELUXE 550W
Cooler: Tuniq Tower 120 Extreme
ddkp5515.jpg


Cooler Tuniq Tower12 Extreme ,Hi-end solution for air cooling.
ddkp5516.jpg


Cooper made basement; five heat-pipe in both left & right side.
ddkp5517.jpg


CPU 200 X 20=> 4000Mhz 1.34V
DDR3 2000 CL8 8-8-25 1T 1.53V

Hyper 4 X PI 32M=> 9m 52.359s
CPUMARK 99=> 622
ddkp554gpi.png


Nuclearus Multi Core => 24715
Fritz Chess Benchmark => 24.71/11858
ddkp554gnm.png


CrystalMark 2004R3 => 294022
ddkp554gcm.png


CINEBENCH R10
1 CPU=> 5577
x CPU=> 20345
ddkp554gcb.png
 
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PCMark Vantage => 15482
ddkp554gpcvan.png


DK P55 performs stable in 200/ 2000MHz.
To compare with other P55, there is no difference in voltage setting.
OC performance is better than average.

DDR3 bandwidth
DDR3 2000 CL8 8-8-25 1TC1.53V
Sandra Memory Bandwidth - 24479MB/s
EVEREST Memory Read - 18567MB/s
ddkp552000mem.png


DDR3 2100 CL8 8-8-25 1TCBIOS 1.63V
Sandra Memory Bandwidth - 26008MB/s
EVEREST Memory Read - 19645MB/s
ddkp552100mem.png


Memory bandwidth of DK P55 is a little bit higher than others. However, the frequency reaches 2100MHz only.
I hope that DFI can break through the bottleneck and release new BIOS for overclocking.
Software bundling is the weakness part in DFI product.
Finally, DFI adds some useful tools for P55 series such as Auto-boost, bclk OC & BIOSecure.
ddkp554gos.png


BIOSecure let you recover BIOS when crashing.
Generally, you have to send the board back when BIOS is crashed; with BIOSecure, you can recover it by yourself immediately.
ddkp5518.jpg


If your board cannot boot anymore, you can user BIOSecure on the other PC or NB as gBIOS programmerh.
Simply ginstallh the new BIOS via mini USB port, your board with be fully recovered within 1 minute.

Then, letfs try higher bclk and DRAM frequency
CPU 210.8 X 20 => 4216Mhz
DDR3 218 CL8 8-8-25 1T

Hyper 4 X PI 32M=> 9m 24.406s
CPUMARK 99=> 653
ddkp5542gpi.png


Nuclearus Multi Core => 25975
Fritz Chess Benchmark => 25.89/12425
ddkp5542gnm.png


CrystalMark 2004R3 => 305172
ddkp5542gcm.png


CINEBENCH R10
1 CPU=> 5966
x CPU=> 21375
ddkp5542gcb.png


PCMark Vantage => 16052
ddkp5542gpcvan.png


CPU works stable in bclk 210.8MHz, it could be higher if you enable gCPU/DRAMCOMPh.
When OC to 4.2GHz, it still passes the test. Of course, if shows the OC performance.
 
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Okay, now letfs try the hi-performance gadget gCORSAIR CMFSSD-64GB2D (RAID 0)h.
ddkp5519.jpg


To test the SATA data transportation.
ddkp5542ghdd.png


Some people concern about the SATA transmission because P55 is a gSingle chiph chipset.
After the test, we can found the data transmission is almost the same with LGA 775 platform.

DFI LANParty DK-P55 T3eH9
Plus
1.New cooler design. Good looking & good quality!
2.SLI & CrossFireX ready, bundled with SLI/ CrossfireX bridge.
3.All made in Japan capacitors; Tantalum capacitor for Audio; Intel 82578DC GbE LAN
4.Various BIOS options; wide range for voltage setting; outstanding CPU/ DDR3 OC
5.8 SATA II & 1 power eSATA
6.Patented BIOSecure technology.

Negative
1. To OC Bclk to 220MHz would be better.
2. To cooperate with more retail store, users can buy DFI product easier.
3. Orange slot & connector should be changed.
ddkp5520.jpg


Performance šššššššš™™
Quality šššššššš™™
Specification ššššššššš™
Appearance šššššššš™™
Price/ Performance šššššššš™™

DFI will launch mini ITX P55 soon, which named gMI P55-T36h.
I think DFI is trying to leverage the advantage from IPC department in order to find a new way out.
The quality and cooler design is outstanding in DK P55,
if DFI can release new BIOS for better OC, the Price/ Performance ratio would be very attractive.

Here comes my DK P55 ABS file for your reference.
If you have similar hardware with me, maybe you can try my setting.
Wish you will get a nice overclocking!

windwithme DFI LANParty DK-P55
 
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Nice review mate as always

I like the Heatsink.
The fact that direct to the copper pipe instead of via a copper/aluminium block part of the design.
It should provide a more efficient cooling solution and faster heat shifting to the fins
 

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