DDR3 2128.4 Cl9 11-10-27 2T the XMP mode
ADIA64 Memory Read - 21312 MB / s
Sandra Memory Bandwidth - 50 004 MB / s
MaXXMEM Memory-Copy - 17276 MB / s
MaXXMEM Reached multi-memory score - 32.39 GByte / sec
Performance comparison of bandwidth with dual-channel LGA 1155 and four-channel LGA 2011
I found that Sandra Memory Bandwidth achieved two times the level of dual-channel bandwidth when compared with CrystalMark
MaXXMEM reached multi-memory score is also about 50% higher compared with dual-channel
Other software at DDR3 bandwidth and dual channel were similar or lower: in the future we may need software that can support four-channel technology
Test of Three Clocks with Different Parameters to Compare Bandwidth Differences
If Sandra Memory Bandwidth is used as a benchmark, DDR3 efficiency will increase 14% from 1600 to 1866
If DDR3 is boosted from 1866 1T to 2133 2T, performance increases by 9.2%: the above was done with DDR3 bandwidth under various clock changes
Power Consumption Test
The OS Desktop did not use any software and C1E power-saving technology was turned on - 80W
OS Desktop did not use any software and the C1E power saving technology was turned off - 174W
With LinX running, we allowed the CPU to reach full speed - 322W
There was little difference in power consumption performance compared with several other X79s I’ve tried before
What’s worth mentioning is that the X79R-AX’s overclocking performance was a bit lower with the C1E standby status enabled
If you use overclocking for a long time, I would recommend that you enable the C1E function for better performance in terms of temperature and power consumption
Temperature performance (room temperature about 21 degrees)
System Standby - 24 to 31
Running LinX with CPU at full speed - 61 to 71
For cooling, we used the Intel RTS 2011LC modular cooling system
This allowed the 3960X OC 4.6GHz desktop to achieve a quite low temperature in a standby environment
In addition, at full speed, the maximum temperature reached only about 71 degrees, so overclocking settings and temperature conditions were more suitable for long-term use
3D test
msi N560GTX-Ti Twin Frozr II
3DMark Vantage CPU SCORE => 89 479
FINAL FANTASY XIV
1920 X 1080 = 4705
StreetFighter IV Benchmark
1920 X-1080 special effects set to maximum => 158.79 FPS
For the 3D performance of a single GTX560 Ti, the LGA 1155 or LGA 2011 currently still achieve the highest standards of a desktop
For the same VGA combined with a different level CPU, the 3D performance will be different: the performance of the Sandy Bridge-E architecture is quite good
In addition, the X79R-AX can support technology up to the same four VGA CrossFireX or SLI boards
For users who need a higher level of 3D performance, based on their needs, they can install the number of VGA boards necessary to obtain higher performance
Also with room temperature at about 21 degrees and the 3960X OC overclocking at 4.6GHz, we used temperature measurement tools to check the temperature of the MOSFET
In standby with C1E enabled, the temperature was about 36.1 degrees, and with C1E disabled, it went up to about 53.9 degrees, and the highest CPU burn-in temperature is approximately 79.2 degrees
Compared with several X79s that I’ve used, the temperature performance of the X79R-AX in standby was relatively higher
At full speed, the temperature was a little lower than the other two X79s, and the average performance of these two models was above average
If you encounter a MOSFET temperature above 80 degrees, I would recommend overclocking to strengthen the heat dissipation in the area of the MOSFET
In this article, windwithme has shared temperature measurements in each X79 as reference
ECS X79R-AX
Strengths
1. The overseas price is about US$310, equivalent to about NT$9175, a better value than a mid-range X79
2. Equipped with the SAS specification’s SATA design, up to 12 internal SATA devices may be installed
3. A rarely seen transmission design for wireless LAN and Bluetooth dongle communications
4. Qooltech IV cooling modules use a serial configuration of MOSFET chipsets for better heat dissipation
5. The high-end X79 has a 4-Way AMD CrossFireX/nVIDIA SLI configuration
6. Use of 14 MOS drivers for power supply, PCI-E, Gen3, CPU/DDR3 installed 15μ gold contacts
Weaknesses
1. DDR3 is only available in 4DIMM packaging
2. When overclocking the CPU, the UEFI interface needs to be enhanced for stability
3. Market visibility and after sales service channels have room for improvement
Performance ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ 85/100
Materials ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ 90/100
Specifications ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ 91/100
Appearance ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ 79/100
Cost ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ 83/100
The visibility of ECS in the Taiwan market is not so good, but ECS brand motherboards are continuing to improve
The X79R-A is better in terms of components and specifications than some other similarly priced X79s, and it even approaches some high-end X79 specifications
In recent years in its high-end product lines, ECS has made visible progress and innovation, which is worthy of recognition
With an 8DIMM design, the X79R-A can reach specifications of a very comprehensive standard
Performance after overclocking was also good with DDR3 bandwidth from 1600 to 2133 above average
The price of the X79R-AX was similar to or slightly higher than other motherboard makers’ entry-level X79s
However, the overall specifications of the components were close to high-end standards in the X79 market, with a good cost to performance ratio among high-end X79 platforms
ECS will be fairly competitive with a future 8DIMM version and in addition to improved hardware, better market channels
Finally, we have recently shared the overclocking performance of five X79s in an Excel file to meet the needs of users for comparison
Summary of X79 windwithme
This article is also post in my blog
WIND3C, Any comments are welcome.